The Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), established a dedicated pavilion at SEMICON Taiwan 2023, the world's second-largest semiconductor exhibition. On the first day of the exhibition, an opening ceremony was held and the successful development of a groundbreaking innovation known as "Hybrid Atomic Layer Deposition; Hy-ALD" was announced at the pavilion. This innovation is designed specifically for coating processes for semiconductors measuring less than two nanometers. Additionally, the pavilion showcased a unique Taiwanese technology, the "Thermal Solution for 1000W HPC Cooling," capable of achieving the world's highest kilowatt-level heat dissipation. This technology surpasses current heat dissipation methods by more than double, establishing Taiwan as a global leader in this field.

This year's exhibition featured 52 cutting-edge innovative technologies, including the following highlights:

Advanced Heterogeneous Integration Technology: ITRI has developed essential silicon intellectual property (IP) for chiplet applications and collaborated with PSMC, a prominent domestic manufacturer. The data transmission speed between chips surpasses that of international companies, marking a critical pathway to extend Moore's Law.

Silicon Carbide Laser Slicing Technology: ITRI has pioneered advanced laser processing technology to boost the slicing speed of SiC ingots and reduce kerf-loss, providing domestic SiC ingot manufacturers with an advanced and efficient wafering solution.

High-Speed Testing Technology for Micro LED Display Module: This high-precision two-in-one technology surpasses the traditional 100-degree light source angle detection by reaching 120 degrees. In comparison to conventional equipment, it enhances measurement efficiency by 50% and allows for customizable testing.