With shrinking transistor sizes, a shift from 2D to 3D structures, and the adoption of metal materials in 2nm chip production, the limitations of current optical measurement become more apparent. Consequently, critical dimensions cannot be accurately measured, directly impacting yield and leading to poor outcomes. The In-Line X-Ray Critical Dimension Metrology System (XRCD) is a specialized system utilized in the semiconductor manufacturing industry for the purpose of measuring critical dimensions using X-ray technology. During semiconductor manufacturing processes, these systems commonly monitor the dimensions and configuration of microstructures to ensure that the produced components meet specified specifications and yield.

ITRI and NanoSeeX have developed the first In-Line X-Ray Critical Dimension Metrology System (XRCD). A perfect balance between measurement area (< 50 micrometre x 50 micrometre) and penetration depth (> 1 micrometre) can be achieved with sufficient signal intensity by combining with highly efficient focusing optical with a specific soft X-ray wavelength. Additionally, utilizing an exclusive background subtraction patent, specific target signals can be extracted and analyzed from complex spatial signals generated by three-dimensional structures.

In signal analysis, NanoSeeX has pioneered the integration of interference signals from interface reflections and high order mode signal techniques, along with multi-physics models. This approach, compared to traditional Fourier transform signal analysis, not only enables more precise thickness measurements but also reduces correlations between fitting parameters in complex 3D structures. With AI-driven machine learning, the measurement accuracy of 3D complex structure CD can reach < 0.1 nm.