The MOEA Technology Pavilion, organized by the Department of Industrial Technology (DoIT) under the Ministry of Economic Affairs (MOEA), opened today at SEMICON Taiwan 2026. Featuring 29 cutting-edge technological innovations, the pavilion focuses on key areas including advanced packaging, AI data center power management, and semiconductor testing and manufacturing equipment, demonstrating Taiwan's strong R&D capabilities and industrial depth. Among the highlights is the Double-Sided RDL Key Process Integration Technology for CoPoS Applications, which enables more precise alignment and stacking of interconnect layers while enhancing package design flexibility and manufacturing yield. The technology has successfully entered the supply chain of a leading global semiconductor manufacturer.

SiC semiconductors are emerging as a key enabling technology for 800 VDC power architectures in AI data centers. ITRI has leveraged Taiwan's industry resources to establish a SiC power semiconductor supply chain and has developed solutions to significantly improve high-voltage power conversion efficiency, fostering the development of a localized power semiconductor supply chain.

Dr. Chao-Chung Kuo, Director General of DoIT, stated that according to data from Morgan Stanley and SEMI, global semiconductor output value, driven by the explosive growth of the AI industry, is expected to surpass US$1 trillion this year and reach US$1.5 trillion by 2030. Over the past six years, DoIT has invested more than NT$40 billion in forward-looking R&D programs, targeting strategic fields such as AI, silicon photonics, quantum computing, advanced packaging, and compound semiconductors. These initiatives promote hardware-software integration, localize wafer manufacturing capabilities, and strengthen international connections, thereby building a resilient and globally trusted advanced semiconductor supply chain.

One of this year's technology highlights is the collaboration with leading materials and equipment companies, including Alliance Material Co., Ltd. (AMC), Everlight Chemical Industrial Corporation, C SUN, and FAVITE Inc., to develop the Double-Sided RDL Key Process Integration Technology for CoPoS Applications, which enhances semiconductor packaging yield and design flexibility. The technology has successfully entered the supply chain of a leading global semiconductor manufacturer.

Moreover, as 800 VDC architecture gains traction in AI data centers, the Industrial Technology Research Institute (ITRI) has developed SiC and GaN technologies for key power conversion systems, including solid-state transformers (SST), energy storage systems, solar inverters, and fast-charging applications. These technologies have been transferred to or developed in collaboration with Tong Hsing Electronic, Niko-Sem, Hon Young Semiconductor, and Mosel Vitelic to establish a localized SiC device supply chain. In addition, ITRI is partnering with Innolux to promote GaN sub-system applications and support the continued development of Taiwan's power semiconductor supply chain. These collaborative R&D achievements will undergo full system verification at a DC grid demonstration site currently under construction.

Following the establishment of the Quantum Industry Development Promotion Office (QITPO) in April this year, QITPO has actively built connections between international quantum technology companies and industry partners in Taiwan. Partnering with SEMI, QITPO announced the signing of memoranda of understanding (MoUs) with SEEQC and NantOptiFab from the United States, as well as Fujitsu from Japan. SEEQC specializes in Single Flux Quantum (SFQ) cryogenic digital control and readout chips, enabling large-scale system integration for quantum computers by reducing wiring complexity, power consumption, and latency. NantOptiFab provides specialty photonic wafer/chip foundry services and manufactures electro-optic components, extending applications to advanced photonics and quantum photonic chips. Fujitsu has extensive expertise in quantum devices, control mechanisms, and system integration, having co-developed a 256-qubit superconducting quantum computer with RIKEN. Moving forward, QITPO will leverage Taiwan's strengths in semiconductors, advanced manufacturing, precision components, and system integration to bridge international demands, fostering joint development, pilot production, testing, and supply chain cooperation to help Taiwanese enterprises enter the global quantum technology supply chain.