The Ministry of Economic Affairs (MOEA) held the "2026 Semicon Network Summit" on September 1, bringing together government officials, industry leaders, researchers, and academics from 38 countries to discuss the future of semiconductors in the age of AI. President Lai Ching-te attended the Summit, underscoring Taiwan's commitment to international cooperation and technological innovation.
Building on the global semiconductor partnership network that was established during the last summit, this year's summit focused on opportunities and challenges arising from the rapid growth of AI. Discussions centered on advanced technologies, cross-sector applications, and deeper international supply chain collaboration in order to shape the next phase of global semiconductor development.
Minister of Economic Affairs Kung Ming-Hsin highlighted four key themes, including advanced semiconductor technologies and materials, international cooperation on silicon photonics, AI-driven robotics and chip innovation, and cybersecurity resilience in the semiconductor industry. Minister Kung emphasized that these areas are critical to the future competitiveness and stability of both the semiconductor and AI sectors.
The Minister also expressed the importance of AI adoption among Taiwan's small and medium-sized enterprises (SMEs). With approximately 1.71 million SMEs accounting for 98% of all businesses and employing around 80% of the workforce in Taiwan, expanding AI capabilities within this sector is seen as essential for Taiwan's long-term economic growth. The MOEA will thus continue promoting policies that support President Lai's goal of enabling one million Taiwanese SMEs to adopt AI technologies.
In prerecorded video remarks, U.S. Under Secretary of State Jacob Helberg called on partner economies to keep investing and building strong and resilient connections. The United States and Taiwan are partners in safeguarding technological security that will shape developments throughout this century. Additionally, SEMI President and CEO Ajit Manocha emphasized Taiwan's key role in the global semiconductor ecosystem and the importance of international collaboration in strengthening supply chain resilience and industry growth.
A highlight of the summit was President Lai's presentation of Medals of Economic Contribution to Doris Hsu, chairperson of GlobalWafers, and Sanjay Mehrotra, chairman, president, and CEO of Micron Technology. The medals honored their longstanding contributions to the semiconductor industry, Taiwan's industrial development, and global semiconductor cooperation.
Held under the theme "Trust, Resilience and Prosperity," the summit featured participation from high-level representatives of the United States, Japan, the EU, Poland, Israel, and other international partners. Discussions focused on strengthening trusted semiconductor networks, advancing next-generation technologies, and expanding cooperation in the AI era.
The MOEA will continue working closely with like-minded partners around the world to advance sustainable growth and unlock new opportunities in both the semiconductor and AI industries.