被動式基材螢光薄膜厚度檢測裝置及方法

工研院創新前瞻技術研究計畫

劉軍廷、張涵寓、何柏青、陳國棟、吳文立、傅尉恩

本揭露是有關於用以量測在固體基底上之超薄膜厚度的量測裝置與方法。待測超薄膜的厚度是由在低的偵測角度藉由基底激發且從待測超薄膜溢漏並穿隧出的螢光的強度量測。從基底產生的螢光的強度夠高且穩定，且因此可提供足夠強的螢光訊號以使得量測快速且精確地進行。偵測角度小，因此雜訊比低，且根據於此揭露的方法的厚度量測的效率高。厚度量測方法可應用至產線上產品量測而不使用標準樣品，因此可快速且有效率地量測產品的厚度。

The present disclosure relates to a device and a method for measuring a thickness of an ultrathin film on a solid substrate.  The thickness of the target ultrathin film is measured from the intensity of the fluorescence converted by the substrate and leaking and tunneling through the target ultrathin film at low detection angle. The fluorescence generated from the substrate has sufficient and stable high intensity, and therefore can provide fluorescence signal strong enough to make the measurement performed rapidly and precisely. The detection angle is small, and therefore the noise ratio is low, and efficiency of thickness measurement according to the method disclosed herein is high.  The thickness measurement method can be applied into In-line product measurement without using standard sample, and therefore the thickness of the product can be measured rapidly and efficiently.