技術摘要(英)
An inspection apparatus for inspection a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis mover, a sensing probe, a height measurement module, a carrier, an illumination light source and a processing element. The sensing probe is erected on the Z-axis mover. The Z-axis mover is adapted to drive the sensing probe to move along a Z-axis. The sensing probe includes a photoelectric sensor, a beam splitter and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter beam. The carrier is adapted to carry the light-emitting diode wafer. The illumination light source is adapted to emit an illumination beam to illuminate the light-emitting diode wafer. In addition, an inspection method for inspecting a light-emitting diode wafers is also provided.